Signal Integrity Issues and Printed Circuit Board Design by Douglas Brooks

Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks ebook
ISBN: 013141884X, 9780131418844
Page: 409
Publisher: Prentice Hall International
Format: djvu

One way that most electrical engineers have traditionally dealt with the problem of temperature rises at the circuit-board level has been by specifying printed-circuit materials with lower dissipation factors. For high-speed digital applications, the use of RO4350B with LoPro foil enables circuit designers to not only preserve signal integrity but, with the 0.004-in. As a world-class semiconductor company, Fujitsu Semiconductor needed to address timing issues at three levels: LSI, PKG, and PCB, especially with the rapidly emerging DDR2/3/4 and SERDES interconnect standards. For backplane designs, the most common form of Smaller vias and tighter pitch driven by large pin count BGA packages makes back-drilling impractical in these applications; due to drill bit size and tolerance issues. The longer the trace, or the greater the frequencies involved, then the greater the need to control the trace impedance. Keep clock traces as straight as possible. Considerations apply to signal transfer through traces on a PCB. In this second issue, we have added . Innovative Signal Integrity & Backplane Solutions (by Bert Simonovich) PCB Vias – An Overview. Basic introduction to the manufacture of controlled impedance printed circuit boards (PCBs). With 2 comments · image Vias make electrical connections between layers on a printed circuit board. When board traces carry signals containing high frequencies, care must be taken to design traces that match the impedance of the driver and receiver devices. A successful high-speed board must effectively integrate the devices and other elements while avoiding signal transmission problems associated with high-speed I/O standards. At these high transmission rates, signal integrity issues become increasingly restrictive on PCB trace and cable lengths, and on design implementation and features. They selected the Mentor Graphics HyperLynx technology, widely adopted at many PCB design sites, as their robust signal and power integrity solution. Printed circuit board (PCB) layout design becomes more complex for high-speed system design with high frequency and higher device pin density. They can carry signals or power between layers. Thickness of the material, to accommodate complex multilayer designs while keeping overall thickness low. Because today's high density CMOS High-Speed PCB Layout Design Guidelines for Signal Integrity Improvement.